Ultra High Vacuum Preparation and Analytical System - Preparation Chamber SPECS (UHV-PREPARATION)

CONTACT US

Guarantor: Josef Polčák, Ph.D.
Instrument status: Operational Operational, 30.10.2024 16:29
Equipment placement: CEITEC Nano - C1.38
Research group: CF: CEITEC Nano


Description:

The chamber for sample heating and sputtering (UHV-Preparation) is one of the instruments of the UHV-Cluster, which combines preparation and in-situ analysis by several complementary methods for the characterization of surfaces and thin films. It provides the possibility of:
- cleaning and basic preparation of the surfaces of the substrates,
- ion sputtering (Ar ions) and annealing (e-beam heating, direct current heating – for clean Si only).
It as well provides the possibility to build-in custom components.


Publications:

  • JAKUB, Z.; TRLLOVÁ SHAHSAVAR, A.; PLANER, J.; HRŮZA, D.; HERICH, O.; PROCHÁZKA, P.; ČECHAL, J., 2024: How the Support Defines Properties of 2D Metal-Organic Frameworks: Fe-TCNQ on Graphene versus Au(111). JOURNAL OF THE AMERICAN CHEMICAL SOCIETY 146(5), p. 3471 - 12, doi: 10.1021/jacs.3c13212; FULL TEXT
    (UHV-DEPOSITION, UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
  • KRAJŇÁK, T.; STARÁ, V.; PROCHÁZKA, P.; PLANER, J.; SKÁLA, T.; BLATNIK, M.; ČECHAL, J., 2024: Robust Dipolar Layers between Organic Semiconductors and Silver for Energy-Level Alignment. ACS APPLIED MATERIALS & INTERFACES 16(14), p. 18099 - 13, doi: 10.1021/acsami.3c18697; FULL TEXT
    (UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM, UHV-DEPOSITION)
  • David, J., 2023: Preparation of elementary 2D materials and heterostructures. MASTER´S THESIS , p. 1 - 69; FULL TEXT
    (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-XPS, UHV-SPM)
  • Jeřábek, F., 2023: Microscopic and spectroscopic analysis of elementary 2D materials. BACHELOR´S THESIS , p. 1 - 42; FULL TEXT
    (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-SPM)
  • VANÍČKOVÁ, E.; PRŮŠA, S.; ŠIKOLA, T., 2023: Bismuth, by high-sensitivity low energy ion scattering. SURFACE SCIENCE SPECTRA 30(2), p. 1 - 15, doi: 10.1116/6.0002669; FULL TEXT
    (UHV-LEIS, UHV-PREPARATION)

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